Method and apparatus for thermal coefficient of expansion matched substrate attachment
US5420472A · kind A · utility
7Cited by
23References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 18, 1994 |
| Grant date | May 30, 1995 |
| Priority date | — |
| Expiry date | Jan 18, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H9/1071
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A radio frequency apparatus desirably includes at least one microelectronic device comprising a substrate including the at least one microelectronic device and a package base for mounting the microelectronic device. The package base includes external interconnections coupled to internal interconnections and an adhesive affixing the substrate to the package base. The adhesive is disposed along a first axis of the substrate. The internal interconnections are coupled to the microelectronic device. A lid is sealed to the package base. The lid seals the microelectronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.