High temperature lamp assembly with improved thermal management properties
US5420769A · kind A · utility
30Cited by
7References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 12, 1993 |
| Grant date | May 30, 1995 |
| Priority date | — |
| Expiry date | Nov 12, 2013 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF21V29/75
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A lamp assembly includes improved thermal management properties provided by a thermal shield received about the neck region of a reflector. This reduces the temperature in the seal region of the light source. Additionally, the thermal shield can be incorporated into a modular housing to provide a contained lamp assembly. The module includes cooling fins that effectively reduce the temperature of the module without adversely effecting the light output. Alternatively, the housing is operatively connected to an external, secondary heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.