Optoelectronic integration of holograms using (110) oriented silicon on (100) oriented silicon waferboard
US5420953A · kind A · utility
27Cited by
19References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 17, 1994 |
| Grant date | May 30, 1995 |
| Priority date | — |
| Expiry date | Feb 17, 2014 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/423
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The disclosure describes an optical interconnect which utilizes a silicon waferboard (1) with grooves (3,4) etched to expose preferred crystallographic planes to effect alignment of focusing elements (5) between optical waveguides (6) and optoelectronic devices (2). The focusing elements (5) are made of silicon wafers and are etched to expose crystal planes which compliment crystal planes of cavities or grooves which are etched in the waferboard. The focusing elements may have holograms (7) formed thereon for efficient focusing to the optical waveguide (6).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.