Technique for enhancing adhesion capability of heat spreaders in molded packages
US5422788A · kind A · utility
21Cited by
9References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 6, 1994 |
| Grant date | Jun 6, 1995 |
| Priority date | — |
| Expiry date | Jul 6, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Adhesion between a heat spreader (15) and a substance (19) to be adhered to the heat spreader can be enhanced by using thermal spray deposition to apply a coating (23) to the heat spreader. The substance to be adhered is applied to the coated heat spreader.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.