Process for the preparation of substrate surfaces for adhesive bonding

US5424133A · kind A · utility

Assignee

• Thera Patent GmbH & Co KG Gesellschaft fur Industrielle Schutzrechte · DE

Inventors

• Gunther Eckhardt · Frieding, DE
• Rainer Guggenberger · Hanerau-Hademarschen, DE
• Peter Koran · Weilheim, DE
• Reinhold Nowak · Adelshofen, DE
• Bernd K. Burger · Gilching, DE

Key dates

• Filing date: Mar 3, 1994
• Grant date: Jun 13, 1995
• Expiry date: Mar 3, 2014

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/31663
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

A process of preparing a substrate surface for a subsequent adhesive bond, coating or pouring operation, by applying to the substrate an adhesion promoting composition comprising either: PA1 (A), (B) and (C); or (A) and (C); or (B) and (C); or (B) of the following ingredients (A)-(C): (A) 0.01 to 90 wt. % of optionally silanized material with a particle size <5 .mu.m and a hardness greater than that of the substrate surface, (B) 20 to 100 wt. % of silanized, silicon-containing material with an average particle size of 2 to 2100 .mu.m, (C) an abrasion agent with a particle size 5 .mu.m as the remainder; wherein the quantities quoted are relative to the total weight of (A)-(C). In the process the composition is applied to the substrate surface using horizontal or predominantly horizontal forces of friction, so that an adhesion promoting layer is formed on the substrate surface. The adhesion promoting composition may optionally contains either a bonding agent or an auxiliary agent, and in a preferred embodiment, the adhesion promoting composition is in the form of a grinding body and contains a bonding agent.