Heat curable organopolysiloxane compositions
US5424374A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Sep 6, 1994 |
| Grant date | Jun 13, 1995 |
| Priority date | — |
| Expiry date | Sep 6, 2014 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2383/04
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Heat curable organopolysiloxane compositions of this invention comprise (A) organopolysiloxanes with at least two alkenyl groups within the molecule, (B) capsules containing organo hydrogen polysiloxanes which comprise (B-1) organo hydrogen polysiloxanes with at least two hydrogen atoms which are bound to silicon atoms within the molecule and (B-2) a thermoplastic resin having a softening point or glass transition temperature in the range from 40.degree. to 200.degree. C., wherein the component (B-1) forms a single nucleus or multiple nuclei and the component (B-2) is a wall material, and (C) platinum group metallic catalysts. The said compositions contain a crosslinking agent which is encapsulated with thermoplastic resins, therefore they possess a superior stability during room temperature storage for a long time period, and the heating of the compositions forms a rapid and uniform crosslinking to prepare the cured products.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.