Inter-pixel thermal isolation for hybrid thermal detectors
US5424544A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 29, 1994 |
| Grant date | Jun 13, 1995 |
| Priority date | — |
| Expiry date | Apr 29, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N15/10
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A thermal detection system (100, 200) includes a focal plane array (102, 202), a thermal isolation structure (104, 204) and an integrated circuit substrate (106, 206). The focal plane array (102, 202) includes thermal sensors (114, 214) formed from a pyroelectric element (116, 216), such as barium strontium titanate (BST). One side of the pyroelectric element (116, 216) is coupled to a contact pad (110, 210) disposed on the integrated circuit substrate (106, 206) through a mesa strip conductor (112, 212) of the thermal isolation structure (104, 204). The other side of the pyroelectric element (116, 216) is coupled to a common electrode (120, 220). In one embodiment, slots (128) are formed in the common electrode (120) intermediate the thermal sensors (114) to improve inter-pixel thermal isolation. In another embodiment, slots (236) are formed in the optical coating (224) to improve inter-pixel thermal isolation. The common electrode (120, 220) may be formed from a thermally insulating material, such as a silicon monoxide and chromium matrix (cermet) or other metal oxide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.