Cooling structure for power supply device
US5424915A · kind A · utility
86Cited by
3References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 10, 1994 |
| Grant date | Jun 13, 1995 |
| Priority date | — |
| Expiry date | Jun 10, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20909
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A power supply device includes power semiconductor devices generating Joule's heat by themselves and circuit components generating no considerable heat by themselves but, as a group, generate a slight rise in temperature, which are included in a power supply circuit of the device. A structure is arranged to forcibly cool these semiconductor devices and circuit components by partitioning the interior of a housing of the Dower supply device to form a passage for an air flow, providing the housing with inlet and outlet openings for the air flow and providing the passage with a ventilating fan.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.