Bonding tool, production and handling thereof
US5425491A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 6, 1994 |
| Grant date | Jun 20, 1995 |
| Priority date | — |
| Expiry date | Oct 6, 2014 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K20/025
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A bonding tool capable of uniformly pressing all electrodes of a semiconductor element and surely bonding all the electrodes and leads, even if the end pressing surface of a tool end part of a bonding tool is enlarged with the large-sized and long-sized tendency of semiconductor elements, is provided in which an end pressing surface of a tool end part fitted to a shank is composed of a hard material, characterized in that the end pressing surface is gradually curved to form a concave surface from the peripheral part to the central part at an application temperature of the bonding tool and the degree of flatness of the concave end pressing surface is in the range of 1 to 5 .mu.m at the application temperature of the bonding tool.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.