Apparatus for the electroplating of thin plastic films

US5425862A · kind A · utility

Assignee

• Hans Hollmuller Maschinenbau GmbH & Co. · DE

Inventors

• Bernd Hartmann · Weisendorf, DE
• Abraham Holtzmann · Bat Yam, IL
• Rainer Haas · Herrenberg, DE
• Werner Renz · Pforzheim, DE

Key dates

• Filing date: Mar 3, 1994
• Grant date: Jun 20, 1995
• Expiry date: Mar 3, 2014

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C25D5/56
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

Apparatus for the electroplating of thin plastic films (1), which are provided on one or both sides with a conductive coating and, if appropriate, may be provided with through-holes, comprises a conveying device (20 to 23) which moves the plastic film (1) horizontally in the region of the chamber (6) filled with electrolyte. The bonding devices (9 to 16), which bring the plastic film (1) to cathodic potential, are located outside the chamber (6) in the "dry". The conveying device includes at least one pair of squeezing rolls at both the inlet and the outlet of chamber (6), the circumferential speed of the pairs of squeezing rolls increasing in the direction of movement of the plastic film (1).