Method of forming structural panel assemblies
US5425908A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Feb 5, 1993 |
| Grant date | Jun 20, 1995 |
| Priority date | — |
| Expiry date | Feb 5, 2013 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2475/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The method of forming rigid panel assemblies of this invention eliminates the requirement for mechanical fasteners and clamps and may be used to bond wall boards to studs, floor joists to wood flooring such as plywood or OSB boards and trusses to ceiling panels. The method of this invention includes applying a thin bead of a thoroughly mixed two-component liquid polyurethane foamable resin adhesive on the surface where the components are to be joined. The foamable resin is formulated to provide a long tack time or delay curing until the assembly is complete. The foamable resin is then allowed to cream and rise before bonding. Where the bead is applied to the side faces of the support members, the support members are preferably turned to orient the foam beads over the fibrous panel, which is preferably supported on a flat horizontal support surface. Finally, the beads are compressed against the fibrous panel, wetting the panel with liquid foam resin before the foam has gelled, permanently bonding the support members to the panel and forming the structural panel assembly. Where an enclosed panel assembly, such as a closed wall is desired, the structural members are attached to a firs…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.