Die bonding connector and method
US5426266A · kind A · utility
37Cited by
1References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 8, 1993 |
| Grant date | Jun 20, 1995 |
| Priority date | — |
| Expiry date | Nov 8, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A connection for mounting an IC die directly to a substrate includes circuit runs deposited on the substrate with bond pad portions having metallization patterns forming ridges and cutout areas. Metal bumps made of gold or other highly conductive malleable material are placed atop the metallization patterns and are forced into the cutout areas between ridges as the dies are compressed onto the substrate. This locks the dies to the circuit run bond pads so as to resist thermal stress and high humidity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.