Poly-p-xylylene films as an orifice plate coating
US5426458A · kind A · utility
85Cited by
2References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 9, 1993 |
| Grant date | Jun 20, 1995 |
| Priority date | — |
| Expiry date | Aug 9, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/10
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A poly-p-xylylene coating has been found to demonstrate superior properties as a thermal ink-jet adhesive material in combination with resistor assemblies employed in thermal ink-jet printheads. This material evidences better adhesion for securing the orifice plate to the barrier material used to form the ink firing chambers within the printhead and superior corrosion resistance to thermal ink-jet inks, compared to other coating materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.