Fabrication process of wiring board
US5426850A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 30, 1992 |
| Grant date | Jun 27, 1995 |
| Priority date | — |
| Expiry date | Nov 30, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49158
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A wiring board is fabricated through the following steps: (A) forming, on one side of an elongated carrier metal foil made of a first metal, a thin layer with a second metal whose etching conditions are different from those of the first metal; (B) forming, on a surface of the thin layer, a desired wiring pattern with a third metal whose etching conditions are different from those of the second metal; (C) superposing the carrier metal foil on an insulating substrate with the side of the wiring pattern being positioned inside, whereby the wiring pattern is embedded in the insulating substrate; and (D) etching off the carrier metal foil and the thin layer at desired parts thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.