Method for mounting electronic parts on a printed circuit board by use of an adhesive composition
US5427642A · kind A · utility
18Cited by
9References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 8, 1991 |
| Grant date | Jun 27, 1995 |
| Priority date | — |
| Expiry date | Oct 8, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1092
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An adhesive composition for use in the mounting of electronic parts on a printed circuit board is disclosed. The composition comprises a photosetting and thermosetting resin ingredient and a long-chain saturated fatty acid amide. Also disclosed is a method for mounting electronic parts on a printed circuit board by the use of such an adhesive composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.