Apparatus and method for electroplating

US5427674A · kind A · utility

Assignee

• Cinram Group, Inc. · CA

Inventors

• Carl G. Langenskiold · Djursholm, SE
• Stefan Olin · Spånga, SE
• Mats A. Hallberg · Sollentuna, SE

Key dates

• Filing date: Jun 28, 1993
• Grant date: Jun 27, 1995
• Expiry date: Jun 28, 2013

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C25D5/619
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

An apparatus for electroplating, particularly in the production of metal matrices for manufacturing articles of plastic, such as compact discs, said apparatus comprising a container having a peripheral wall and opposed first and second end walls so as to form a plating space therein, adapted to house an electrolyte, and an anode, a carrier with an electrically conductive surface to be plated forming the cathode and means being arranged between the anode and the cathode for providing a flow of electrolyte from said cathode towards said anode. For allowing a faster production of metal matrices with better quality it is suggested according to the invention that the peripheral wall is formed with an internal contour which substantially corresponds to the surface to be plated, said carrier forming the second container end wall which through intermediate current supply members is sealingly urged against the mating edge of the peripheral wall, while the anode is located adjacent said first end wall of the container. (FIG. 1 )