Imaging process
US5427886A · kind A · utility
4Cited by
2References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 9, 1994 |
| Grant date | Jun 27, 1995 |
| Priority date | — |
| Expiry date | Mar 9, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/165
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A novel imaging process is disclosed comprising preparing microcapsules having an elongation of less than 1%, adhering the microcapsules to a substrate then imagewise rupturing certain of said microcapsules upon selective application of a thermal energy input comprising a .DELTA.T of at least 115.degree. C. per 1 millisecond. The process makes use of novel microcapsules polymerized at a temperature of from 65.degree. C. to 100.degree. C. which are heat resistant yet heat fracturable upon application of a thermal pulse.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.