Hot-melt adhesive composition
US5428109A · kind A · utility
3Cited by
4References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 16, 1993 |
| Grant date | Jun 27, 1995 |
| Priority date | — |
| Expiry date | Dec 16, 2013 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/02
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A hot-melt adhesive composition containing, (A) per 10 to 80 parts by weight of a base polymer, (B) 10 to 80 parts by weight of a stickiness-imparting agent which is a copolymer of a particular styrene-type monomer and a particular indene-type monomer, the molar ratio of the indene-type monomer to the styrene-type monomer being from 99/1 to 30/70, and the weight average molecular weight of said copolymer being from 300 to 5000. The hot-melt adhesive composition exhibits excellent heat-resistant adhesiveness and heat-resistant creeping property, and has a low-molecular weight and exhibits good hue.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.