Heat sink attachment assembly
US5428897A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 29, 1994 |
| Grant date | Jul 4, 1995 |
| Priority date | — |
| Expiry date | Sep 29, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49925
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A mounting spring clamp for securing a heat sink to a device package is secured to the heat sink by positioning the central body portion of the spring clamp in an attachment clip. The clip is compressed and positioned in a groove of the heat sink. The clip comprises a semi-circular shaped seat with ears extending from both sides of the seat and is made from a flexible material. Compression of the ears reduces the seat diameter, thereby trapping the spring's central body, and also creates spring force in the ears, thereby trapping the clip between the fins of the heat sink. The mounting spring has an elongated body with ends extending from the axis of its central body. The ends may be trapped or hooked in appropriate receivers on a frame or socket holding an electronic device package to secure the heat sink adjacent the device package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.