Low stress waveguide window/feedthrough assembly
US5430257A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 12, 1992 |
| Grant date | Jul 4, 1995 |
| Priority date | — |
| Expiry date | Aug 12, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01P1/08
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An apparatus for mounting a waveguide window or conduction member into a housing such that a smooth gradient of the coefficient of thermal expansion exists between the housing and the window or conduction member, thereby reducing the internal stress which results from ambient temperature variations. The apparatus comprises a frame member for mounting a feedthrough member into a housing. The frame member includes a buffer section having a plurality of sections, each section having a material which progressively varies the coefficient of thermal expansion. The frame member further includes additional stress relief features and structural elements facilitating manufacture and assembly of the apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.