Electrical conductive polymer matrix
US5431571A · kind A · utility
82Cited by
17References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 22, 1993 |
| Grant date | Jul 11, 1995 |
| Priority date | — |
| Expiry date | Nov 22, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31544
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electrical interconnect is described which is a structure comprising a polymer matrix of a microstructure of nodes separated by void spaces and being interconnected by fibrils. The nodes are generally aligned elongated columns and have conductive particles embedded in them. The void spaces may be filled with a nonconductive adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.