Patent · US Expired

Solder suspension for the application of thin layers of solder to substrates

US5431745A · kind A · utility

8Cited by

10References

10Claims

0Family size

Assignee

Degussa AG · DE

Inventors

Manfred Koschlig · Aschaffenburg, DE
Wolfgang Weber · Hemau, DE
Klaus Zimmermann · Alzenau, DE

Key dates

Filing date	Apr 11, 1994
Grant date	Jul 11, 1995
Priority date	—
Expiry date	Apr 11, 2014

Classification

Technology area (CPC H)Electricity
CPC primaryH05K3/3485
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A solder suspension is disclosed of solder powder, organic binder, organic solvent, and, if necessary, flux, with which it is possible to apply solder layers without cracks and pores to substrates by means of immersion or spraying. The solder powder must have a particle size of 5 to 50 .mu.m, where 55 to 70% of the particles are smaller than the particle size at the maximum on the particle size distribution curve. In addition, the ratio between the average particle size of the solder powder and the density of the solder powder must be between 0.1 and 20.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.