Method of mounting semiconductor device
US5431863A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 4, 1993 |
| Grant date | Jul 11, 1995 |
| Priority date | — |
| Expiry date | Aug 4, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10977
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of mounting a semiconductor device including a film carrier having an insulating film having on one side thereof a connecting lead and a semiconductor element junctioned with the film carrier on an outer substrate, which includes forming an opening for adhesive forcing or adhesive injection in the insulating film within its bonding area to be in contact with a land part on the outer substrate and in an area near the bonding area, connecting the connecting lead to the land part on the outer substrate, and forcing or injecting an adhesive through the opening formed in the insulating film into the space between the film carrier and the outer substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.