Patent · US Expired

High thermal strength bonding fiber

US5431994A · kind A · utility

41Cited by
55References
110Claims
0Family size

Assignee

Inventor

Key dates

Filing dateSep 2, 1992
Grant dateJul 11, 1995
Priority date
Expiry dateSep 2, 2012

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T442/681
  • WIPO fieldTextile and paper machines
  • WIPO sectorMechanical engineering

Abstract

High strength spun melt fiber, preparation thereof utilizing threadline oxidative chain scission degradation of hot fiber spun from polymer component(s) having a broad molecular weight distribution in conjunction with a delayed quench step, and corresponding nonwoven material obtained therefrom.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.