Photocuring adhesive containing an oligo siloxanyl di(meth)acrylate
US5432208A · kind A · utility
2Cited by
4References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 14, 1993 |
| Grant date | Jul 11, 1995 |
| Priority date | — |
| Expiry date | Dec 14, 2013 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J4/06
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
This invention relates to a photocuring adhesive characterized in that a photoinitiator is added to a monomer composition comprising 20 to 50 wt % of the oligosiloxanyl di(meth)acrylate represented by the structural formula (1) shown below, 20 to 60 wt % of a hydrophobic mono (meth)acrylate having a hydrocarbon group containing no less than six carbon atoms in a side chain, and 1 to 80% of a hydrophilic monomer capable of undergoing free radical polymerization: ##STR1## R.sub.1 and R.sub.2 both being either hydrogen or methyl, m.sub.1 and m.sub.2 being an integer in the range 2 to 5, and n being an integer in the range 5 to 30.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.