Patent · US Expired

Method and apparatus for fabrication of multibeam lasers

US5432535A · kind A · utility

20Cited by
15References
25Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 18, 1992
Grant dateJul 11, 1995
Priority date
Expiry dateDec 18, 2012

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01S5/4031
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

The present invention is a multispot laser light source assembled from at least two individual laser diodes in accordance with a design model. The multispot laser includes at least two semiconductor laser diodes, both of which are permanently affixed to a chip carrier. The chip carrier rigidly supports the diodes and conducts heat away from the the diodes to be dissipated by a heat sink. The present invention is further characterized by a predefined relationship between the chip carrier material, the relative dimensions of the chip carrier, and the separation distance of the diodes from the heatsink, which results in significant reduction in the thermal droop and crosstalk between the diodes.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.