Electronic module comprising a stack of IC chips each interacting with an IC chip secured to the stack
US5432729A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 8, 1994 |
| Grant date | Jul 11, 1995 |
| Priority date | — |
| Expiry date | Jun 8, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/10253
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic module comprising a multiplicity of prestacked IC chips, such as memory chips, and an IC chip, referred to as an active substrate or active backplane, to which the stack of chips is directly secured. A multiplicity of aligned solder bumps may interconnect the stack and the substrate, providing electrical, mechanical and thermal interconnection. The active substrate is a layer containing substantial amounts of integrated circuitry, which interfaces, on one hand, with the integrated circuitry in the stacked chips, and, on the other hand, with the external computer bus system. Some of the high priority circuitry which may be included in the substrate is used for control, fault-tolerance, buffering, and data management.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.