Process for the application of solder composition on the pins of electronic components
US5433372A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 22, 1992 |
| Grant date | Jul 18, 1995 |
| Priority date | — |
| Expiry date | Dec 22, 2012 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K1/085
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A solder composition is applied to the pins of an electronic component. The pins of the component are brought into contact with solder at a soldering station having a bath exposed to a controlled atmosphere of low oxygen content maintained in a hood enclosing at least the surface of the bath. The controlled atmosphere is comprised of at least one neutral gas and a gaseous silicon hydride whose content is between 50.times.10.sup.-6 and 2.times.10.sup.-3 of the volume of the controlled atmosphere. The controlled atmosphere is produced: PA1 a) by introducing into the hood the neutral gas to bring the residual oxygen content to less than 200 ppm, then PA1 b) by introducing into the hood the neutral gas and the silicon hydride with a content greater than four times the residual oxygen content in the controlled atmosphere, at the end of step a).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.