Acid bath for the galvanic deposition of copper, and the use of such a bath

US5433840A · kind A · utility

Assignee

• Atotech Deutschland GmbH & Co. KG · DE

Inventors

• Wolfgang Dahms · Berlin, DE
• Horst Westphal · Berlin, DE
• Michael Jonat · Falkensee, DE

Key dates

• Filing date: Apr 6, 1994
• Grant date: Jul 18, 1995
• Expiry date: Apr 6, 2014

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C25D3/38
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

An aqueous acid bath for the galvanic deposition of bright, ductile and smooth copper coats which is suitable for decorative purposes as well as for strengthening the conductors of printed circuits. The bath is characterized by a content of polyalkylene glycol ether. When combined with thio compounds containing water-soluble groups, these additions produce an electrolyte with excellent stability. Polymeric phenazonium compounds, polymeric nitrogen compounds and/or thio compounds containing nitrogen may also be successfully combined, in addition, depending on the desired properties.