Patent · US Expired

Flameproofed thermoplastic polyamide molding materials

US5434209A · kind A · utility

2Cited by

5References

8Claims

0Family size

Assignee

BASF SE

Inventors

Brigitte Gareiss · Grünstadt, DE
Petra Baierweck · Schifferstadt, DE

Key dates

Filing date	Dec 2, 1993
Grant date	Jul 18, 1995
Priority date	—
Expiry date	Dec 2, 2013

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08L77/00
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

Flameproofed thermoplastic molding materials contain PA1 A) 30-98% by weight of a thermoplastic polyamide, PA1 B) 1-30% by weight of red phosphorus, PA1 C) 1-15% by weight of a mono- or diphenolic compound or of a mixture thereof, PA1 D) 0-60% by weight of a fibrous or particulate filler or of a mixture thereof and PA1 E) 0-30% by weight of an elastomeric polymer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.