Pressure sensitive adhesive with enhanced adhesion to low surface energy substrates
US5434213A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 30, 1993 |
| Grant date | Jul 18, 1995 |
| Priority date | — |
| Expiry date | Jun 30, 2013 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/04
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Broadly, the present invention is directed to a pressure sensitive adhesive that possesses enhanced adhesion to low surface energy substrates. The inventive PSA comprises the free-radical polymerization reaction product prepared in the presence of a free-radical initiator and dispersed in organic solvent of between about 0.5% and 10%, by weight of the non-volatile solids of the reaction product, of an organic solvent soluble, high ethylene-containing polymer; and a mixture of ethylenically-unsaturated monomers. Such mixture of monomers comprises between 0% and not substantially above about 10%, by weight of the non-volatile solids of the reaction product, of an ethylenically-unsaturated carboxylic acid or anhydride; and the balance being a non-carboxyl/non-anhydride-functional vinyl monomer or mixture of monomers. The T.sub.g of the polymerized mixture of monomers is not substantially above about -20.degree. C. The polymerization reaction product has a molecular weight which ranges from between about 100,000 and 600,000 and a T.sub.g not substantially above about -20.degree. C. Optionally, the reaction product can be cross-linked with an aluminum, titanium, or zirconium salt or che…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.