Patent · US Expired

Thermoset and polyarylsulfone resin system that forms an interpenetrating network

US5434224A · kind A · utility

16Cited by
5References
22Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 8, 1993
Grant dateJul 18, 1995
Priority date
Expiry dateMar 8, 2013

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S525/906
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

A polymer composition especially suitable for producing fiber-reinforced structures having advantageous fracture toughness comprises a polyarylsulphone component and a thermoset resin component, each of which components is present at least partly as a phase continuous in at least one dimension. Preferred polyarylsulphones contain repeating units (PhSO.sub.2 Ph).sub.n and (Ph).sub.a linked through ether and/or thioether, where Ph is phenylene, n=1 to 2 and a=1 to 3; and such polyarylsulphones having amino end groups are provided as new compounds. The compositions can be made by spinodal decomposition of a mixture of the polyarylsulphone and a thermoset resin precursor.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.