Patent · US Expired

Method and apparatus for low temperature HEMT-like material testing

US5434505A · kind A · utility

1Cited by
7References
23Claims
0Family size

Assignee

Inventor

Key dates

Filing dateJul 30, 1993
Grant dateJul 18, 1995
Priority date
Expiry dateJul 30, 2013

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L22/14
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

To screen or test the electrical properties of HEMT-like wafers for their quality, the critical layer qualities of a wafer (16) are evaluated by measuring its conductivity (sigma or s) and mobility (mu or m) at upper and lower temperatures, which need only be sufficiently different as to remove uncertainties in the test data but, in practice, are room and liquid nitrogen temperatures. Novel equations show (1) that the crucial quality or merit factor (n.sub.s) the electron sheet density of two-dimensional electron gas (2DEG), can be determined by measuring the total layer conductivity (sigma or s) at the lower or liquid nitrogen temperature and mobility (mu or m) at the upper or room temperature and (2) by measuring overall layer effective mobility (mu or m) at both room and liquid nitrogen (the upper and lower) temperatures to provide a means to measure the value of the 2DEG density, n.sub.s which has better accuracy then where the temperature of mobility is only made at room temperature.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.