Interconnection method and structure for organic circuit boards
US5435057A · kind A · utility
248Cited by
24References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 14, 1994 |
| Grant date | Jul 25, 1995 |
| Priority date | — |
| Expiry date | Feb 14, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Polymeric subcomposites of a circuit board are interconnected by metallic dendrites on electrical contact pads whereby electrical contact pads of one or the subcomposites are larger widthwise than electrical contact pads of the other subcomposite.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.