Hybrid/microwave enclosures and method of making same
US5435058A · kind A · utility
4Cited by
1References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 17, 1992 |
| Grant date | Jul 25, 1995 |
| Priority date | — |
| Expiry date | Jul 17, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49806
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of forming enclosures for microwave and hybrid devices and the enclosure itself wherein the metals to be joined are thin (i.e., less than 40 mils thick) and/or thick (up to several inches) and wherein metallurgical hermetic bonds are provided between adjacent metals which are generally difficult to bond to each other and may be bonded by a select number of bonding processes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.