Direct integrated circuit interconnector system
US5435734A · kind A · utility
Inventor
Key dates
| Filing date | May 4, 1993 |
| Grant date | Jul 25, 1995 |
| Priority date | — |
| Expiry date | May 4, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system for directly connecting one integrated circuit to another achieved by depositing gold onto the bonding pads of both integrated circuits, aligning the respective bonding pads and biasing both circuits into gas-tight, electrically conductive relation through the use of an initial compression force and a spring assembly. The gold bumps deposited on the bonding pads include ridges to ensure an optimal gas-tight seal. Alignment posts are also inserted through the host integrated circuit, which match notches cut into the periphery of the target integrated circuit, to ensure proper polarization and mating of the bonding pads of each integrated circuit. The integrated circuits and spring assembly are housed, and thus held together by, a carrier assembly. The carrier assembly also serves to dissipate heat generated by the integrated circuits, adapts for mounting on a printed circuit board, and includes a ferrule over an optical sensing area provided on the host integrated circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.