Apparatus and method for fluid processing of electronic packaging with flow pattern change
US5435885A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 25, 1994 |
| Grant date | Jul 25, 1995 |
| Priority date | — |
| Expiry date | Jan 25, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/0085
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A fluid treatment apparatus including a first fluid flow manifold having at least one fluid head positioned on a first side of a surface of a substrate to be treated by a fluid. The first fluid flow manifold includes at least two sets of a plurality of fluid jet injectors formed therein and apparatus for directing a fluid into the fluid jet injectors. Each of the fluid jet injectors creates a fluid jet impinging upon the surface of the substrate. Apparatus is interconnected with the first fluid flow manifold for supplying fluid to the fluid injector jets. Apparatus connected between the supply apparatus and the first fluid flow manifold alternates a flow of the fluid through the sets of fluid jet injectors. A fluid source is connected to the fluid supplying apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.