Protective electronic coatings using filled polysilazanes
US5436083A · kind A · utility
52Cited by
1References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 1, 1994 |
| Grant date | Jul 25, 1995 |
| Priority date | — |
| Expiry date | Apr 1, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a method of forming protective coatings on electronic substrates and the substrates coated thereby. The method comprises applying a coating comprising a polysilazane and a filler on a substrate and heating the coated substrate at a temperature sufficient to convert the polysilazane to a ceramic.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.