Spring clip and heat sink assembly for electronic components
US5436798A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jan 21, 1994 |
| Grant date | Jul 25, 1995 |
| Priority date | — |
| Expiry date | Jan 21, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A spring clip for clamping a heat sink module which has a plurality of upwardly extending cooling elements to an electronic module. The spring clip includes a horizontal grid like foot portion which engages the upper surface of the heat sink module a vertical leg portion which extends along the side of the heat sink module and the electronic module and a bendable and resilient connecting portion which extends from the inner end of the foot portion to the upper end of the leg portion. The electronic module has a first latching element at its side surface for engaging a complementary second latching element which forms part of the vertical leg portion of the spring clip. The spring clip is rendered from a non-clamping position in which the latching element of the clip is above the latching element of the electronic module to a clamping position by bending the connecting portion downwardly from its inner end to lower the vertical leg portion so that the first and second latching elements are engaged.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.