Method for making a multilayer metal leadframe
US5437096A · kind A · utility
4Cited by
5References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 28, 1994 |
| Grant date | Aug 1, 1995 |
| Priority date | — |
| Expiry date | Feb 28, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A fabrication method and leadframe construction in which the leadframe is formed by selectively removing portions of a multilayer clad strip to expose a selected pattern of a conductive metal to conform to the desired application of the leadframe. The clad strip may be formed of a base layer of copper alloy, a conducting layer of aluminum or aluminum alloy, and an upper layer of copper or a copper alloy. A layer of tin or lead-tin alloy may be plated onto the upper layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.