High frequency module including a flexible substrate
US5438305A · kind A · utility
72Cited by
9References
21Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Aug 3, 1992 |
| Grant date | Aug 1, 1995 |
| Priority date | — |
| Expiry date | Aug 3, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/189
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A high frequency module is disclosed which comprises a high frequency device in a package, a circuit formed on a flexible substrate in the package, the circuit, the high frequency device and input/output terminals of the package being connected electrically.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.