Molded-in lead frames
US5438481A · kind A · utility
19Cited by
15References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 20, 1993 |
| Grant date | Aug 1, 1995 |
| Priority date | — |
| Expiry date | May 20, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The disclosure features lead frames, molded lead frames and adapters and sockets produced by molding these lead frames. In general, the lead frames comprise a frame and a circuit, wherein the circuit comprises a plurality of electrical conducting elements. The elements are held in position by the frame, and each element comprises an area within the element suitable for positioning a pin through the element to electrically connect the element with the board. The lead frame can be molded in plastic and trimmed to remove the frame to leave each element electrically separate from each other element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.