Laser package and method of assembly
US5438580A · kind A · utility
26Cited by
6References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 24, 1993 |
| Grant date | Aug 1, 1995 |
| Priority date | — |
| Expiry date | Sep 24, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/02469
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A laser package is designed for large scale assembly by machinig a piec3 part of relatively large dimensions where the part has a slot for holding a laser. The piece part is mounted on heatsink of like dimensions. A second piece part includes an elongated groove for holding a fiber lens plate where the second piece part is mounted against the edge of the heat sink such that the lens is properly aligned with the laser. Thus, the critical alignment of the laser and the fiber is achieved by the alignment of like dimensioned piece parts of relatively large dimensions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.