Method of manufacturing a chip card
US5438750A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Dec 20, 1994 |
| Grant date | Aug 8, 1995 |
| Priority date | — |
| Expiry date | Dec 20, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49124
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a chip card comprising a card base in which a cover section is secured, which cover section comprises a circuit support and at least one microcircuit arranged on a lower surface of the circuit support, which lower surface faces the interior of a recess and is spaced from the inner surface of the bottom of the recess, in which method an encapsulant is applied to said inner surface. According to the invention the method comprises the following steps: PA0 a) applying a metered mount of said encapsulant to a first part (7) of the inner surface of the bottom (6) of the recess, which first part is surrounded by a raised portion (11), which raised portion (11) itself is surrounded by a second part (8) of said inner surface in such manner that the encapsulant (36) is retained by capillarity by the raised portion (11), which is adapted to be spaced over at least a part of its circumference from the cover section (20) when said section is secured to the card base, PA0 b) fixing the cover section (20) on the card base (1), the encapsulant (36) completely filling a first volume (V'.sub.1) situated between said first part (7) and the cover section (20) and partly filli…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.