Measuring method and apparatus using a lamb wave
US5438872A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 18, 1992 |
| Grant date | Aug 8, 1995 |
| Priority date | — |
| Expiry date | Jun 18, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S73/01
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus for measuring a thickness of plate material includes a plate material whose thickness is to be measured, a vibration pen to generate a plate wave by applying a vibration to the plate material, a vibration sensor which is disposed at an arbitrary position on the plate material and detects the plate wave which has propagated on the plate material, an extracting circuit to extract different frequency components of the plate wave detected by the vibration sensor, a timer to measure arrival times to the vibration sensor of the signals of the different frequency components extracted by the extracting circuit, and a controller to obtain a thickness of the plate material on the basis of the arrival times measured by the timer and the frequency components corresponding thereto. The extracting circuit is a band pass filter.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.