Epoxy resin-basin composite material
US5439746A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Mar 18, 1994 |
| Grant date | Aug 8, 1995 |
| Priority date | — |
| Expiry date | Mar 18, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/67
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Disclosed is an epoxy resin-based composite material formed by coating or impregnating a sheet-like reinforcement with an epoxy resin composition, followed by curing the resin composition. The epoxy resin composition comprises a compound having at least one epoxy group, a compound having an active hydrogen, a silicon compound having or generating hydroxy group bonded to silicon atom, and an organometallic compound. The epoxy resin may further comprise a maleimide compound or a powdery and granular material and a short fiber. The composite material ensures the properties of the epoxy resin material in terms of the mechanical strength, corrosion resistance, heat resistance and electrical properties. Besides, the composite material exhibits excellent crack resistance and impact resistance. Further, the epoxy resin composition contained in the composite material exhibits sufficient curing characteristics and, thus, the operation for forming the composite material is facilitated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.