Cadmium-free and lead-free thick film conductor composition
US5439852A · kind A · utility
34Cited by
6References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 1, 1994 |
| Grant date | Aug 8, 1995 |
| Priority date | — |
| Expiry date | Aug 1, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/092
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The invention is directed to a thick film paste composition comprising electrically conductive particles and finely divided particles of a glass composition comprising by mole % 5-70% Bi.sub.2 O.sub.3, 18-35% SiO.sub.2, 0.1-40% CuO, 0.5-25% ZnO, 0.5-40% CoO, 0.5-40% Fe.sub.2 O.sub.3, and 0.5-40% MnO, which the glass composition is free of lead and cadmium, all dispersed in an organic medium.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.