Thermo-curable resin composition, and a method for producing a copper-clad laminate using same
US5439986A · kind A · utility
12Cited by
9References
8Claims
0Family size
Assignee
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Key dates
| Filing date | Nov 16, 1993 |
| Grant date | Aug 8, 1995 |
| Priority date | — |
| Expiry date | Nov 16, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S525/935
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thermo-curable resin composition which contains (a) an aromatic polyamide oligomer having polymerizable unsaturated group(s) at both terminals or within side chain(s), (b) a maleimide compound and (c) an epoxy resin; and a copper foil laminate which comprises impregnating said composition into substrates, followed by bonding by co-pressing copper foils is provided. The copper-clad laminate of the present invention has excellent adhesiveness to copper foil, heat resistance and electrical properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.