High heat deflection temperature blends of certain polyesters with polyetherimides
US5439987A · kind A · utility
20Cited by
14References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 31, 1994 |
| Grant date | Aug 8, 1995 |
| Priority date | — |
| Expiry date | May 31, 2014 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L79/08
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thermoplastic molding composition having a high neat deflection temperature but a relatively low melt extrusion temperature is formed by blending a polyetherimide with about 35 to about 80 weight percent of a copolyester of terephthalic and/or isophthalic acid and a glycol component comprising ethylene glycol and up to about 60 mol percent of 1,4-cyclohexanedimethanol. The blend also has a high flexural modulus and can be used to form plastic articles that can be molded at moderate temperatures but retain flexural strength at elevated temperatures. Certain compositions of the invention are clear, single phase solid solutions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.