Electrical connecting device and method for making same
US5440454A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 20, 1994 |
| Grant date | Aug 8, 1995 |
| Priority date | — |
| Expiry date | Jul 20, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49215
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electrical connecting device including a first circuit board providing thereon with input/output terminals, each of the terminals having a tip surface coated with gallium and a second circuit board providing thereon with contact terminals, each of the terminals having a tip surface coated with indium or tin. A low-melting point alloy layer is formed by a mutual action between gallium and indium or tin, when the input/output terminals of the first circuit board are in contact with the respective terminals of the second circuit board and electrically connected to each other. The second metal layer includes a plurality of wire-like metal supports extending substantially perpendicular to the surface of the terminal and a low-melting point metal retained by the wire-like metal supports.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.